Environmentally Friendly
          Packaging Options

UltraCMOS™ Die

A Silicon-on-Sapphire die is inherenty RoHS compliant because it uses .01% or less of hazardous substances as defined by Directive 2002/95/EC. The PE42692 Materials Declaration Form for our popular SP9T antenna switch in Flip Chip packaging gives a typical example of the materials used to create one of our products.

Commercial Packages

Peregrine Semiconductor is proud to offer Lead-Free (Pb-free) and RoHS compliant versions of the most popular packages for its UltraCMOS™ products in order to reduce hazardous substances.

All Lead-free products use matte tin plating (Sn) onto copper lead frames, rather than tin-lead (PbSn) solder that is used on standard products. The electronics industry has considerable experience with matte Sn finishes, which have been widely used. The reliability aspects of matte Sn plating have been well-researched, including solderability with both Pb-free and standard SnPb solders, and low whisker growth even in accelerated temperature/humidity conditions.

New Pb-free products are developed and released on a regular basis depending upon market demand and other factors. As new products are introduced and regulatory conditions change, Peregrine will maintain its commitment to doing its part to preserve our environment. If the Pb-free solution that you need is not shown, please consult with Peregrine or any of its worldwide sales representatives for solutions to your specific requirements.