At Mobile World Congress 2014, we hosted customers, industry analysts and industry media for demonstrations of our new integrated radio frequency front-end (RFFE) Global 1. The Global 1 solution will enable OEMs to design LTE smartphones and tablets that support all 40+ frequency bands globally on a single, silicon chip. This engineering marvel, UltraCMOS® Global 1, affects the entire wireless ecosystem and will save OEMs substantial time and money. We’ve been developing integrated RFFE components for years, but the final piece was achieved when our CMOS-based power amplifier (PA) could meet the performance of GaAs-based PAs.
