Mobile World Congress and Global 1 Launch
At Mobile World Congress 2014, we hosted customers, industry analysts and industry media for demonstrations of our new integrated radio frequency front-end (RFFE) Global 1. The Global 1 solution will enable OEMs to design LTE smartphones and tablets that support all 40+ frequency bands globally on a single, silicon chip. This engineering marvel, UltraCMOS® Global 1, affects […]