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Application Notes

TitleDate CreatedAssociated Parts
Application Note: RF Switch Performance Advantages of UltraCMOS® Technology over GaAs Technology2025-09-25PE4239
Application Note: Advantages of UltraCMOS® DSAs with Serial-Addressability2025-12-05PE43711; PE43712; PE43713
Application Note: Using Blocking Capacitors with UltraCMOS® Devices2025-09-25PE42359; PE4239; PE42421; PE42422; PE42427; PE42430; PE4245; PE4256; PE4257; PE4259; PE42742
Application Note: DTC Theory of Operation2025-11-04PE64102; PE64904; PE64906; PE64907; PE64909
Application Note: Configuring the PE42850 as an SP3T or SP5T2025-10-09PE42850
Application Note: PE4259 and PE42359 Complimentary Logic Control Circuit Recommendations2025-11-18PE42359; PE4259
Application Note: PE42542 and PE42543 SP4T RF Switch Vector De-embedding2025-10-23PE42542; PE42543
Application Note: PE42522 High-frequency Performance Improvement Through Narrowband Matching2026-01-15PE42522
Application Note: The PE42524 40 GHz SPDT Substrate Carrier Assembly Guide2016-01-12PE42524
Application Note: Introduction and Operation of the PE42020 True DC RF Switch2013-12-09PE42020
Application Note: Optimizing the Phase Accuracy of the PE44820 Phase Shifter2025-09-27PE44820
Application Note: PE613010 and PE613050 Tuning Control Switches2026-03-23PE613010; PE613050
Application Note: Using a 50Ω Switch Within a 75Ω System2013-12-09PE423422; PE42359; PE423641; PE4239; PE42420; PE42421; PE42422; PE42423; PE42424; PE42427; PE42430; PE42440; PE42442; PE4245; PE42451; PE42452; PE4250; PE4251; PE4256; PE4257; PE4259; PE42641; PE42721; PE42722; PE42723; PE42724; PE42742; PE42750; PE42820; PE42850
Application Note: PE46130 and PE46140 Insertion Loss Stabilizer2016-11-03PE46130; PE46140
Application Note: PE4152 Mixer in LO Bypass Mode2013-12-09PE4152
Application Note: UltraCMOS® Power Limiter Modes and Applications2013-12-09PE45140; PE45361; PE45450
Application Note: Thermal Characterization2013-12-09PE4140; PE4141; PE4151; PE4152; PE42020; PE423422; PE42359; PE423641; PE4239; PE42420; PE42421; PE42422; PE42423; PE42427; PE42430; PE42440; PE42441; PE42442; PE4245; PE42451; PE4250; PE4251; PE42520; PE42521; PE42522; PE42524; PE42525; PE42540; PE42542; PE42543; PE42553; PE4256; PE4257; PE4259; PE42641; PE426525; PE42721; PE42722; PE42723; PE42724; PE42742; PE42750; PE42820; PE42823; PE42850; PE4312; PE4314; PE43205; PE43508; PE43610; PE43614; PE43704; PE43705; PE43711; PE43712; PE43713; PE44820; PE45140; PE45450; PE46120; PE46130; PE46140; PE613010; PE613050; PE64102; PE64904; PE64906; PE64907; PE64909
Application Note: Understanding Switch Linearity Performance2016-08-16PE42424
Application Note: Using an MPAC Device to Create a High Resolution Phase Shifter2016-11-03PE46120; PE46130; PE46140
Application Note: Replacing PE4302 with PE43122025-11-14PE4312
Application Note: Soldering Guidelines for Land Grid Array Packages2013-12-09PE42420; PE42441; PE42522; PE42540; PE42542; PE42543
Application Note: Soldering Guidelines for Mounting Bottom-terminated Components2013-12-09PE4152; PE42020; PE423422; PE423641; PE42422; PE42423; PE42426; PE42427; PE42520; PE42521; PE42553; PE4256; PE42721; PE42722; PE42723; PE42724; PE42742; PE42750; PE42820; PE42823; PE42850; PE4312; PE4314; PE43205; PE43704; PE43705; PE43711; PE43712; PE43713; PE44820; PE45140; PE45450; PE46120; PE46130; PE46140; PE613010; PE613050; PE64102; PE64904; PE64906; PE64907; PE64909
Application Note: Replacing PE4302 with PE43142025-11-14PE4314
Application Note: Considerations Using PE29100 EVB with EPC8009 eGaN FETs2016-07-11PE29100
Application Note: PE42525 and PE426525 Performance Optimization2022-10-03PE42525; PE426525
Application Note: Simultaneous Path Selection in a Dual-switch Configuration2013-12-09PE42412; PE42462; PE42482; PE42512; PE42562; PE42582; PE426462; PE426482
Application Note: Using Peregrine’s High-Speed FET Drivers2018-01-24PE29101; PE29102
Application Note: Class D Audio Using the PE291022013-12-09PE29102
Application Note: Using the PE29102 as a Power-up Sequencer for Depletion-mode RF GaN HEMT Amplifiers2013-12-09PE29102
Application Note: PE29101/102 Footprint Requirements2013-12-09PE29101; PE29102
Application Note: PE43508 55 GHz DSA Substrate Carrier Assembly Guide2013-12-09PE43508
Application Note: Design Considerations for Connecting Multiple DSAs in a Cascaded-Series Configuration2013-12-09PE4312; PE43711; PE43712; PE43713
Application Note: Reducing the Attenuation Error for a Cascaded DSA Design2013-12-09PE43711; PE43712; PE43713
Application Note: Soldering Guidelines for Mounting Wafer-level Chip Scale Packages (WLCSP)2025-04-17PE25200; PE25203; PE25204; PE25208; PE25213;
Application Note: Programming Multiple Devices Using a Single SPI Bus2023-10-20PE4312; PE4314; PE43205; PE43508; PE43610; PE43614; PE43620; PE43650; PE43665; PE43670; PE43704; PE43705; PE43711; PE43712; PE43713; PE44820; PE46120; PE46130; PE46140; PE64102; PE64904; PE64906; PE64907; PE64909
Application Note: Using the PE42422 and PE423422 in Wi-Fi 6E and 7 Applications2020-12-07PE423422; PE42422
Application Note: PE42545 Performance Optimization2022-11-30PE42545
Application Note: Bias and Sequence of the PE42420 RF Switch2023-08-02PE42420
Application Note: PCB Land Pattern and Segmented Exposed Pad Design Guidelines for Soldering Land Grid Array Packages2025-06-04PE42443; PE42444; PE42445; PE42446; PE42447; PE42448
Application Note: PE562212 Front-end Module 2.4 GHz Wi-Fi Performance2013-12-09PE562212
Application Note: 6-GHz Performance Improvement2025-08-29PE42448
Application Note: Power Supply and Control Logic2026-03-26PE42020
Application Note: PE44951 Phase Shifter and DSA EVK: Optimizing the Phase and Insertion Loss Bench Measurements2026-01-28PE44951
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Markets

  • Best-in-class RF performance
  • Optimal form factors with high levels of integration
  • Proven track record in top-tier smartphones
  • Active member of 3GPP and other industry affiliations
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Power Management

  • 5G antenna-integrated module (AiM) co-designed with Murata
  • High-efficiency 26 GHz, 28 GHz and 39 GHz beamforming front ends supporting bands n257, n258, n261 and n260
  • Advanced, highly integrated package and antenna technology
  • Modular AiM approach for building scalable antenna arrays
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Markets

  • Best-in-class RF performance
  • Optimal form factors with high levels of integration
  • Proven track record in top-tier smartphones
  • Active member of 3GPP and other industry affiliations

  • RF Switches All

    Industry-leading linearity and RF performance
    HaRP™ technology enhancement reduces gate lag and insertion loss drift
    Monolithic CMOS solution that integrates RF, analog and digital
    Best-in-class ESD and reliability

  • High Linearity RF Switches

    Industry-leading linearity and RF performance
    HaRP™ technology enhancement reduces gate lag and insertion loss drift
    Monolithic CMOS solution that integrates RF, analog and digital
    Best-in-class ESD and reliability

  • High Isolation RF Switches

    Industry-leading isolation and RF performance
    HaRP™ technology enhancement reduces gate lag and insertion loss drift
    Monolithic CMOS solution that integrates RF, analog and digital
    Best-in-class ESD and reliability

  • Low Insertion Loss RF Switches

    Industry-leading insertion loss and RF performance
    HaRP™ technology enhancement reduces gate lag and insertion loss drift
    Monolithic CMOS solution that integrates RF, analog and digital
    Best-in-class ESD and reliability

  • Antenna Tuning Switches

    Industry-leading RF power handling and ruggedness
    Best-in-class harmonic and linearity
    Small form factor with robust ESD and reliability

  • 75Ω Wired Broadband Switches

    Unmatched linearity performance for DOCSIS 3.1
    HaRP™ technology enhancement reduces gate lag and insertion loss drift
    Monolithic CMOS solution that integrates RF, analog and digital
    Best-in-class ESD ratings and reliability

  • Broadband RF Switches

    Wideband support with a frequency range from 0 Hz to 67 GHz
    Industry-leading insertion loss, isolation, linearity and settling time
    HaRP™ technology enhancement reduces gate lag and insertion loss drift
    Best-in-class ESD and reliability

  • High Power Switches

    Industry-leading power handling and RF performance
    HaRP™ technology enhancement reduces gate lag and insertion loss drift
    Monolithic CMOS solution that integrates RF, analog and digital
    Best-in-class ESD and reliability

  • Automotive Switches

    AEC-Q100 Grade 2-certified supporting temperatures up to +105°C
    HaRP™ technology enhancement reduces gate lag and insertion loss drift
    Monolithic CMOS solution that integrates RF, analog and digital
    Best-in-class ESD and reliability

  • Extended Temperature RF Switches

    Wide temperature range support from -55°C to +125°C
    HaRP™ technology enhancement reduces gate lag and insertion loss drift
    Monolithic CMOS solution that integrates RF, analog and digital
    Best-in-class ESD and reliability

  • 75Ω Wired Broadband RF Digital Step Attenuators

    High linearity, fast switching time with wide bandwidth
    Best-in-class attenuation error with fine attenuation steps
    Monolithic CMOS solution that integrates RF, analog and digital
    Excellent ESD protection and reliability

  • Glitchless RF Digital Step Attenuators

    High linearity, fast switching time with wide bandwidth
    Best-in-class attenuation error with fine attenuation steps
    Monolithic CMOS solution that integrates RF, analog and digital
    Excellent ESD protection and reliability

  • General-purpose RF Digital Step Attenuators

    High linearity, fast switching time with wide bandwidth
    Best-in-class attenuation error with fine attenuation steps
    Monolithic CMOS solution that integrates RF, analog and digital
    Excellent ESD protection and reliability

  • 2.4 GHz IoT FEMs

    Industry-leading monolithic Wi-Fi RF front-end solutions
    High linearity performance for Wi-Fi 6 and W-Fi 6E
    Compact form factors integrating high-performance RF, analog and digital
    Best-in-class ESD and reliability

  • Phase Shifters

    Ideal solutions for optimizing transmission phase angle
    Low root-mean-square (RMS) phase and amplitude error with fine phase resolution
    Digital control interface with parallel and serial programming options
    Best-in-class ESD and reliability

  • Monolithic Phase & Amplitude Controllers (MPACs)

    Reliable phase and amplitude control for next-generation communications
    Monolithic CMOS solution that integrates RF, analog and digital
    Integrated solution for Doherty power amplifier optimization (MPAC–Doherty)

  • Digital Tunable Capacitors (DTCs)

    Small form factor with high Q
    Monolithically integrated impedance tuning solution
    Wide-band tuning coverage, minimum mismatch losses, high linearity and fast switching speed
    Best-in-class ESD and reliability

  • Power Limiters

    Highly integrated solutions, smaller and more reliable than PIN-diode solutions
    Adjustable threshold control for maximum design flexibility
    High power handling and linearity required for wide-dynamic-range designs
    Fast response and recovery times for instantaneous protection and rapid return

  • Prescalers

    Exceptional performance with high-frequency support up to 13.5 GHz
    Low phase noise performance and low power consumption solutions
    Bare-die solutions for a wide variety of compact high-performance applications
    Best-in-class ESD and reliability

  • Mixers

    Broadband quad MOSFET array cores for high performance
    Industry-leading linearity, isolation and low conversion loss
    Available in MSOP, DFN and QFN packages
    Best-in-class ESD and reliability

  • Switch LNA

    Integrates dual-channel LNA with bypass function & high-power switch
    20W average RF input power
    Low noise figure of 0.9 dB
    +105°C operating temperature

  • Charge Pump Capacitor Divider

    Unique, patented architecture to enable higher overall system, power conversion efficiency
    Fully integrated solutions from 15W to 160W
    Virtually lossless (up to 99% peak) conversion and soft-switching topology
    Parallel operation to higher power levels
    Available through our parent company Murata

  • 2-Stage Buck Regulators

    Family of DC-DC buck voltage regulators ICs and modules for telecoms, datacoms, server and storage applications
    Compact solution size offering best-in-class efficiencies for low profile applications (<1.2mm)
    Fully programmable via I2C and with accurate on-board telemetry
    Available through our parent company Murata

  • 2-Stage Boost Regulators - LED Backlight Drivers

    Ultra-high efficiency (up to 96%) LED boosts for LCD displays
    Product family includes products for 1-cell, 2-cell, and 3-cell inputs such as tablets, notebooks and 2-in-1 convertibles
    Enables very low profile (<0.7 mm) solutions and halves power-conversion losses compared to leading alternatives
    Up to 15-bit resolution via I²C or PWM control
    High accuracy with tight matching at low LED current

  • Multi-level Converters

    Industry-first 4-level and 3-level conversion for fixed input voltages (USB_PD)
    Configurable as charge pump divide-by-3 and divide-by-2 for variable input voltages (USB_PPS)
    Wide range input voltage 4.5V to 18V compatible with USB and wireless charging Qi sources
    Reverse boost capability
    High-accuracy current and voltage telemetry
    Best-in-class efficiency for low-profile applications (<1 mm)
    Targets fast-charging battery applications

Power Management

  • Unique, patented architecture to enable higher overall system, power conversion efficiency
  • Fully integrated solutions from 15W to 160W
  • Virtually lossless (up to 99% peak) conversion and soft-switching topology
  • Parallel operation to higher power levels
  • Available through our parent company Murata
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Integrated products

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RF Mixers & Limiters

  • Exceptional performance with high-frequency support
  • Highly integrated, reliable solutions in a small form factor
  • Variety of packaging options for maximum design flexibility
  • Best-in-class ESD and reliability
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Front End Modules

  • Industry-leading monolithic Wi-Fi RF front-end solutions
  • High linearity performance for Wi-Fi 6 and W-Fi 6E
  • Compact form factors integrating high-performance RF, analog and digital
  • Best-in-class ESD and reliability
View Products

RF Phase & Amplitude Control

  • Reliable phase and amplitude control for next-generation communications
  • Monolithic CMOS solution that integrates RF, analog and digital
  • Digital control interface with parallel and serial programming options
  • Best-in-class ESD and reliability
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RF Attenuators

  • High linearity, fast switching time with wide bandwidth
  • Best-in-class attenuation error with fine attenuation steps
  • Monolithic CMOS solution that integrates RF, analog and digital
  • Excellent ESD protection and reliability
View Products

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RF Switches

  • Industry-leading RF performance
  • HaRP™ technology enhancement
  • Monolithic CMOS solution that integrates RF, analog and digital
  • Best-in-class ESD and reliability
View Products
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